| Date: | 2024/05/06 |
|---|---|
| Document No. | 11300030401 |
| Title: | Full Wang International Development Co., Ltd. 2nd Secured Corporate Bond Issue in 2024 will be listed on the TPEx from May 7, 2024. |
| Description: | 1. Issuer: Full Wang International Development Co., Ltd. 2. Bond Name: Full Wang International Development Co., Ltd. 2nd Secured Corporate Bond Issue in 2024 (1) Code: B86213 (2) Issue amount: TWD 0.2 billion (3) Issue price: 100% (4) Issue date: May 7, 2024 (5) Maturity date: May 7, 2027 (6) Tenor: 3 years (7) Coupon rate: 1.69% (8) The bond is subject to selling restrictions. 3. For the full terms and conditions of the bonds, please refer to the legal documentation as can be found on the website of Market Observation Post System (https://mops.twse.com.tw/mops/web/index). |